Offshore PCB Manufacturing

Global Innovation excels in the following areas:
Single Sided
Double Sided
Multilayer
4 through 30 layer
Blind and Buried Via:
  • Sequential Lamination
  • Depth Drill
  • Micro Vias
    • Conductive Filled
    • Non Conductive Filled
Hybrid Builds
Advanced Edge Plating Capabilities
Testing:
  • Continuity
  • Hi Pot
  • Inductance (Patented)

See our Design for Manufacturing (DFM) for fabrication capabilities.

Key Contacts

Bryan Nolan
Director of Operations
214-291-1427
bryannolan@globalinnovationcorp.com
Oscar Cammuse
Director of Quality
214-291-1427
ocammuse@globalinnovationcorp.com
Greg Mitchell
Product Engineering Manager
214-291-1427
gmitchell@globalinnovationcorp.com
Tom Holder
Customer Service and Design Manager
214-291-1427
tholder@globalinnovationcorp.com